: Heat-producing components should be approximately evenly distributed to prevent "hot spots". Effective Cooling Surface (
| Method | Accuracy | Cost | Time | Input Data Required | Best For | |--------|----------|------|------|---------------------|----------| | | High | $$$$ ($5k-20k) | Weeks | Prototype, measurement setup | Final certification, high-risk designs | | TR 60890 (enclosure method) | Medium ( ±20%) | $ (PDF only) | Hours | Component losses, dimensions | Routine designs, early estimates | | CFD simulation | High | $$ (software license) | Days to weeks | Full 3D model, thermal properties | Complex non-standard enclosures | | Rule of thumb (over-engineering) | Low | Free | Minutes | None | Simple, low-density panels |
Accounting for non-uniform heat sources within an enclosure.
The calculation validity has been extended to assemblies with rated currents up to 3,200 A (previously 3,150 A).
The methodology described in the involves a systematic assessment of heat generation versus dissipation: IEC TR 60890:2022