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guideline that measures what strain your manufacturing process actually applies to the board. The difference between the two defines your safety margin Where to Access You can purchase and download the full IPC/JEDEC-9704A PDF directly from official standards organizations: JEDEC Website (often available as a free preview or for purchase). Are you looking to implement a strain testing plan for a specific process, like ICT or final assembly? ipc-9704 pdf
The primary purpose of IPC/JEDEC-9704 is to identify and characterize processes that subject a PCB to excessive mechanical stress. High strain levels can lead to various failure modes, including solder ball cracking, pad lifting, and trace damage. IPC/JEDEC-9704A (released in 2012). If you are searching for the PDF, you
IPC/JEDEC-9704A provides industry-standard guidelines for measuring mechanical strain on Printed Circuit Assemblies to prevent solder joint damage during manufacturing processes like testing and depanelization. It mandates specific techniques, such as using three-element rosette strain gages and high-frequency data acquisition, to ensure, in particular, the structural integrity of BGA components. For technical implementation details, refer to the [Link: PCBSync guide https://pcbsync.com/ipc-jedec-9704/]. Are you looking to implement a strain testing